Clean (Ge)

The "Clean (Ge)" cleanliness group is part of the SNF/ExFab contamination policy.

The following is a list of equipment that fall into the "Clean (Ge)" category.

Equipment name & NEMO ID	Training Required & Charges	Cleanliness	Location	Notes
AMAT P5000 Etcher p5000etch	Dry Etcher AMAT P5000 Training	Clean, Clean (Ge), Semiclean	SNF Cleanroom Paul G Allen L107
Wet Bench Resist Strip wbresstrip-1	Wet Bench Resist Strip	Clean (Ge), Semiclean, Flexible	SNF Cleanroom Paul G Allen L107	Wet Resist Removal: SRS-100 or PRS1000

Equipment name & NEMO ID	Technique	Cleanliness	Primary Materials Etched	Other Materials Etched	Process Temperature Range	Chemicals	Gases	Substrate Size	Substrate Type	Maximum Load
AMAT P5000 Etcher p5000etch	Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Reactive Ion Etching (RIE) > Magnetically Enhanced RIE (MERIE)	Clean, Clean (Ge), Semiclean	Si Si3N4 SiGe SiO₂ SiON	C C C dimethylpolysiloxane poly(p-xylylene) SiC Ti Various C-based W WSi₂ PI Resist Ti Tungsten			80% He/ 20%O₂ Ar CF₄ CHF₃ Cl₂ HBr He N₂ NF₃ O₂ SF₆
Wet Bench Resist Strip wbresstrip-1	Wet Chemical Processing Cleaning > Resist Removal > Wet Resist Removal	Clean (Ge), Semiclean, Flexible	Resist		20 °C - 60 °C	PRS-1000 SRS-100		Pieces 2" 3" 4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC)	25 4 inch wafers