Processing Technique Equipment name & NEMO ID Cleanliness Primary Materials Etched Substrate Size Maximum Load (number of wafers) Gases Notes Stylus Tip Radius
Vapor Etching SPTS uetch vapor etch
uetch 		"All"
1

Pieces need a carrier wafer; Isotropic Etching
Vapor Etching Xactix Xenon Difluoride Etcher
xactix 		"All"
1

Isotropic Si etching; can be used for backside Si removal on small pieces