Our thermal ALD systems primarily use DI water as a co-reactant with the metal-organic precursor to deposit films. In practice, these chambers are often used for low temperature depositions since the cooling time is much shorter than the PE-ALD tools.

A couple of useful links that help navigate ALD research in general (not specific to the SNF) are: 

  • www.plasma-ald.com: a website created by Dr. Mark Sowa that has a survey of plasma ALD literature
  • www.atomiclimits.com: a website created by Professor Erwin Kessels, Eindhoven University, that provides a dynamic discussion of the ALD landscape.
Processing Technique Equipment name & NEMO ID Cleanliness Materials Lab Supplied Material Thickness Range Substrate Size Process Temperature Range Gases Notes Stylus Tip Radius
Thermal ALD MVD
mvd 		Flexible
1.00 Å - 50.00 nm
24 °C - 150 °C

Reactor located inside glovebox
Thermal ALD Savannah ALD
savannah 		Flexible
1.00 Å - 50.00 nm
24 °C - 250 °C