reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode
Reactor located inside glovebox
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
