Matrix Plasma Resist Strip
matrix |
Matrix Plasma Resist Strip Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating. |
Micromanipulator6000 IV-CV probe station
micromanipulator6000 |
micromanipulator6000 IV-CV probe station Training |
"All" |
SNF Exfab Paul G Allen 151 Ocean |
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Nanospec 210XP
nanospec2 |
Nanospec Training |
"All" |
SNF Exfab Paul G Allen L104 Stinson |
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
|
Oven (White)
white-oven |
White Oven Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable. |
Oven 110°C post-bake
oven110 |
Resist Postbake Oven 110°C Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Bakes wafers with resist after the development, called post-bake. |
Oven 90°C prebake
oven90 |
Resist Prebake Oven 90°C Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Bakes wafers after resist coating. |
Oven BlueM 200°C to 430°C
bluem |
Blue M Oven Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Convection in N2. Cure. Programmable. |
Oxford Dielectric Etcher
oxford-rie |
Oxford Dielectric Etcher Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers |
Oxford Plasma Pro ICP-RIE ALE
Ox-ALE |
Oxford Plasma Pro ICP-RIE ALE Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
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Oxford Plasma Pro PECVD
Ox-PECVD |
Oxford Plasma Pro PECVD Training |
Semiclean, Flexible |
SNF Paul G Allen L107 Cleanroom |
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