Bakes wafers with resist after the development, called post-bake.
Bakes wafers after resist coating.
Convection in N2. Cure. Programmable.
Low power, high pressure plasma; low bias, minimal damage. Often used for surface treatment.
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run
