The following is a list of equipment where 2 inch round substrates are allowed.
Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.
Manual solvent cleaning of substrates or resist removal.
Manual solvent cleaning, two ultrasonic baths.
Manual solvent cleaning, hot plate
Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Wet Resist Removal: SRS-100 or PRS1000
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
Isotropic Si etching; can be used for backside Si removal on small pieces