| Processing Technique | Equipment name & NEMO ID | Cleanliness | Chemicals | Substrate Size | Maximum Load (number of wafers) | Notes | Stylus Tip Radius |
|---|---|---|---|---|---|---|---|
| Pre-Diffusion Clean, Pre-LPCVD or Pre-Metal Clean, Wet Chemical Processing |
Wet Bench Clean 1 wbclean-1 |
Clean | 25 |
No resist allowed. Resist should have been removed at the wbclean_res-piranha. |
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| Pre-Diffusion Clean, Pre-LPCVD or Pre-Metal Clean, Wet Chemical Processing |
Wet Bench Clean 2 wbclean-2 |
Clean | 25 |
No resist allowed. Resist should have been removed at the wbclean_res-piranha |