Overview
GNP-400
The POLI-400L CMP (Chemical Mechanical Polishing) system is designed to polish standard 4” wafers (no pieces). CMP is often used to polish wafers, to planarize patterned surfaces, and to smooth surface roughness.
Cleanliness:
Processing Technique(s)
Lab Organization, Location, and NEMO Information
Lab Organization:
Location:
NEMO Area:
NEMO ID:
cmp
Training and Maintenance
Lab Facility:
Training Charges:
1.50 hours
Primary Trainer:
Primary Maintenance:
Backup Maintenance:
Steps to become a tool user
Become a member of nano@stanford.
Become a member of SNF.
- Study the relevant operating procedures:
Shadow other labmembers who are using the tool. Make sure to get hands on experience with set up and clean up since these are critical to proper tool function.
- Contact the primary trainer: Carsen Kline