Physical Vapor Deposition (PVD)
PVD is characterized by a process in which the material goes from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputte ring and evapor ation .
Technique Tabs Main Tab
Detail Tab
Processing Technique
Equipment name & NEMO ID
Cleanliness
Materials Lab Supplied
Material Thickness Range
Substrate Size
Maximum Load (number of wafers)
Process Temperature Range
Gases
Notes
Evaporation
Intlvac Evaporator Intlvac_evap
Clean , Semiclean
12 4 inch wafers, 2 6 inch wafers
Sputtering
Hummer V Sputter Coater hummer
Flexible
Evaporation
AJA2 Evaporator aja2-evap
Flexible
4"x3 or 6"x1 wafers or pieces
For more than 300nm deposition, please contact Gabe Catalano <gcatalano@stanford.edu> in advance
Evaporation
AJA Evaporator aja-evap
Flexible
4"x3 or 6"x1 wafers or pieces
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
Evaporation
CHA Solutions II Evaporator cha-evap
Flexible
4"x15 or 6"x3 wafers or pieces
For more than 300nm deposition, please contact Neel Mehta <nmehta26@stanford.edu> in advance
Sputtering
Lesker Sputter lesker-sputter
Flexible
1 4 inch wafer, 1 6 inch wafer
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Sputtering
Lesker2 Sputter lesker2-sputter
Semiclean
one 4 inch wafer, one 6 inch wafer
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter