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ExFab: 155A Venice

mr_equipment

Specifications

Equipment name & NEMO ID	Technique	Cleanliness	Primary Materials Etched	Material Thickness Range	Materials Lab Supplied	Materials User Supplied	Gases	Substrate Size	Substrate Type	Maximum Load
AJA Evaporator aja-evap	Deposition > Physical Vapor Deposition (PVD) > Evaporation	Flexible		0.00 - 300.00 nm	Ag Al Au Co Cr Cu Fe Ge Hf Ni Ni_xO_y Pd Pt SiO₂ Ti Titania			Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs) , (Various) , (Various)	4"x3 or 6"x1 wafers or pieces
Epilog Fusion M2 Laser Cutter lasercutter	Machining > Laser Cutting	Flexible
Hummer V Sputter Coater hummer	Deposition > Physical Vapor Deposition (PVD) > Sputtering	Flexible
Lesker Sputter lesker-sputter	Deposition > Physical Vapor Deposition (PVD) > Sputtering	Flexible			Ag Al AlSi Au Co Cr Cu Fe Nb Ni Pd Si SiO₂ Ta Ti TiN W Alumina ITO	CoFeB Ge Hf In₂O₃ LaB₆ Ru Sc Sn TiN WO₃ ZnO₃ ZrY GST Hafnia Moly Ti Tungsten		Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)	1 4 inch wafer, 1 6 inch wafer
Minitech-GX Micromill micromill	Machining > Micromilling	Flexible
Optomec Printer optomec-printer	Deposition > Ink	Flexible						Pieces 2" 3" 4" 6"
Oriel Deep UV Exposure Lamp oriel-duv	Other	Flexible
Plasmaetch PE-50 plasma-etch	Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Reactive Ion Etching (RIE)	Flexible	Resist				78% N₂, 21% O₂, ~1% Ar	Pieces 2" 3" 4" 6"		Multiple

Summary

Equipment name & NEMO ID	Training Required & Charges	Cleanliness	Location	Notes
AJA Evaporator aja-evap	Evaporator AJA training	Flexible	SNF Exfab Paul G Allen 155A Venice	For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
Epilog Fusion M2 Laser Cutter lasercutter	Lasercutter Epilog Fusion M2 Training	Flexible	SNF Exfab Paul G Allen 155A Venice
Hummer V Sputter Coater hummer	Hummer V Sputter Coater Training	Flexible	SNF Exfab Paul G Allen L119 Año Nuevo
Lesker Sputter lesker-sputter	Sputter Lesker 1&2 Training	Flexible	SNF Exfab Paul G Allen 155A Venice	reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Minitech-GX Micromill micromill	Micromill Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Optomec Printer optomec-printer	Optomec Printer Training	Flexible	SNF Exfab Paul G Allen 155A Venice
Oriel Deep UV Exposure Lamp oriel-duv	Oriel DUV Training	Flexible	SNF Exfab Paul G Allen 155A Venice
Plasmaetch PE-50 plasma-etch	Plasmaetch PE-50 Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks	Low power, high pressure plasma; low bias, minimal damage. Often used for surface treatment At SNF - nSiL lab

Equipment name & NEMO ID	Training Required & Charges	Cleanliness	Location	Notes
AJA Evaporator aja-evap	Evaporator AJA training	Flexible	SNF Exfab Paul G Allen 155A Venice	For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
Epilog Fusion M2 Laser Cutter lasercutter	Lasercutter Epilog Fusion M2 Training	Flexible	SNF Exfab Paul G Allen 155A Venice
Hummer V Sputter Coater hummer	Hummer V Sputter Coater Training	Flexible	SNF Exfab Paul G Allen L119 Año Nuevo
Lesker Sputter lesker-sputter	Sputter Lesker 1&2 Training	Flexible	SNF Exfab Paul G Allen 155A Venice	reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Minitech-GX Micromill micromill	Micromill Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Optomec Printer optomec-printer	Optomec Printer Training	Flexible	SNF Exfab Paul G Allen 155A Venice
Oriel Deep UV Exposure Lamp oriel-duv	Oriel DUV Training	Flexible	SNF Exfab Paul G Allen 155A Venice
Plasmaetch PE-50 plasma-etch	Plasmaetch PE-50 Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks	Low power, high pressure plasma; low bias, minimal damage. Often used for surface treatment At SNF - nSiL lab

Equipment name & NEMO ID	Technique	Cleanliness	Primary Materials Etched	Material Thickness Range	Materials Lab Supplied	Materials User Supplied	Gases	Substrate Size	Substrate Type	Maximum Load
AJA Evaporator aja-evap	Deposition > Physical Vapor Deposition (PVD) > Evaporation	Flexible		0.00 - 300.00 nm	Ag Al Au Co Cr Cu Fe Ge Hf Ni Ni_xO_y Pd Pt SiO₂ Ti Titania			Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs) , (Various) , (Various)	4"x3 or 6"x1 wafers or pieces
Epilog Fusion M2 Laser Cutter lasercutter	Machining > Laser Cutting	Flexible
Hummer V Sputter Coater hummer	Deposition > Physical Vapor Deposition (PVD) > Sputtering	Flexible
Lesker Sputter lesker-sputter	Deposition > Physical Vapor Deposition (PVD) > Sputtering	Flexible			Ag Al AlSi Au Co Cr Cu Fe Nb Ni Pd Si SiO₂ Ta Ti TiN W Alumina ITO	CoFeB Ge Hf In₂O₃ LaB₆ Ru Sc Sn TiN WO₃ ZnO₃ ZrY GST Hafnia Moly Ti Tungsten		Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)	1 4 inch wafer, 1 6 inch wafer
Minitech-GX Micromill micromill	Machining > Micromilling	Flexible
Optomec Printer optomec-printer	Deposition > Ink	Flexible						Pieces 2" 3" 4" 6"
Oriel Deep UV Exposure Lamp oriel-duv	Other	Flexible
Plasmaetch PE-50 plasma-etch	Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Reactive Ion Etching (RIE)	Flexible	Resist				78% N₂, 21% O₂, ~1% Ar	Pieces 2" 3" 4" 6"		Multiple