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Wafer preparation before resist

Technique Tabs

Main Tab

Processing Techniques	Equipment name & NEMO ID	Teaser Blurb	Cleanliness	Location
Wafer Prime (HMDS), Singe	HMDS Vapor Prime Oven, YES yes	YES oven: Wafer singe at 150ºC and HMDS prime.	All	SNF Cleanroom Paul G Allen L107
Wafer Prime (HMDS)	HMDS Vapor Prime Oven, YES2 yes2	YES2 oven: HMDS prime at 150ºC	All	SNF Exfab Paul G Allen 104 Stinson

Detail Tab

Processing Technique	Equipment name & NEMO ID	Cleanliness	Chemicals	Substrate Size	Maximum Load (number of wafers)	Process Temperature Range	Developer	Notes
Wafer Prime (HMDS), Singe	HMDS Vapor Prime Oven, YES yes	All	[(CH₃)₃Si]₂NH	Pieces 2" 3" 4" 6"		150 ºC		Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
Wafer Prime (HMDS)	HMDS Vapor Prime Oven, YES2 yes2	All			25	150 ºC	[(CH₃)₃Si]₂NH	Singe and prime. No Resist allowed!