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Flexible

The "Flexible" cleanliness group is part of the SNF/ExFab contamination policy.

The following is a list of equipment that fall into the "Flexible" category.

Equipment name & NEMO ID	Training Required & Charges	Cleanliness	Location	Notes
Fisher Accuspin 24C centrifuge	Centrifuge Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Formlabs Form2 3D Printer form2-3d-printer	3D Printer Form2 Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Fujifilm Dimatix Ink Jet Printer nanoinkjet	Ink Jet Printer Dimatix Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Fumehood 1 fumehood1	Fumehood 1 Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Fumehood 2 fumehood2	Fumehood 2 Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Fumehood 3 fumehood3	Fumehood 3 Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Fumehood 4 fumehood4	Fumehood 4 Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Glovebox-l glovebox-l	Glovebox-l Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Glovebox-r glovebox-r	Glovebox-r Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Hummer V Sputter Coater hummer	Hummer V Sputter Coater Training	Flexible	SNF Exfab Paul G Allen 104 Stinson
Ika T18 Disperser disperser	IKA Disperser Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Jasco UV-Vis-NIR jasco-uv-vis-nir	Jasco UV-Vis-NIR Training	Flexible	SNF Exfab Paul G Allen 151 Ocean
Lesker Sputter lesker-sputter	Sputter Lesker 1&2 Training	Flexible	SNF Exfab Paul G Allen 155A Venice	reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Malvern Dynamic Light Scattering (DLS) Zetasizer malvern-dls	Malvern Dynamic Light Scattering (DLS) Zetasizer Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Matrix Plasma Resist Strip matrix	Matrix Plasma Resist Strip Training	Flexible	SNF Paul G Allen L107 Cleanroom	Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.
Minitech-GX Micromill micromill	Micromill Training	Flexible	SNF Exfab Paul G Allen 155A Venice
MRC Reactive Ion Etcher mrc	MRC Reactive Ion Etcher Training	Flexible	SNF Paul G Allen L107 Cleanroom	Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode
MVD mvd	MVD Training	Flexible	SNF Paul G Allen L107 Cleanroom	Reactor located inside glovebox
Nanoscribe Photonics GT nanoscribe	Nanoscribe Photonics GT Training	Flexible	SNF Exfab Paul G Allen 104 Stinson
Optomec Printer optomec-printer	Optomec Printer Training	Flexible	SNF Exfab Paul G Allen 155A Venice

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Equipment name & NEMO ID	Technique	Cleanliness	Primary Materials Etched	Other Materials Etched	Material Thickness Range	Materials Lab Supplied	Materials User Supplied	Process Temperature Range	Gases	Accessories Available	Substrate Size	Substrate Type	Maximum Load
Fisher Accuspin 24C centrifuge	Centrifugation	Flexible
Formlabs Form2 3D Printer form2-3d-printer	3D Printing	Flexible											Multiple parts - depending on the final part size
Fujifilm Dimatix Ink Jet Printer nanoinkjet	Deposition > Ink	Flexible				PROM Approval Required for Materials
Fumehood 1 fumehood1	Controlled Environment	Flexible
Fumehood 2 fumehood2	Controlled Environment	Flexible
Fumehood 3 fumehood3	Controlled Environment	Flexible
Fumehood 4 fumehood4	Controlled Environment	Flexible
Glovebox-l glovebox-l	Controlled Environment	Flexible
Glovebox-r glovebox-r	Controlled Environment Material Transfer	Flexible				Various 2D Materials			N₂
Hummer V Sputter Coater hummer	Deposition > Physical Vapor Deposition (PVD) > Sputtering	Flexible
Ika T18 Disperser disperser	Sonication	Flexible
Jasco UV-Vis-NIR jasco-uv-vis-nir	Characterization	Flexible
Lesker Sputter lesker-sputter	Deposition > Physical Vapor Deposition (PVD) > Sputtering	Flexible				Ag Al AlSi Au Co Cr Cu Fe Nb Ni Pd Si SiO₂ Ta Ti TiN W Alumina ITO	CoFeB Ge Hf In₂O₃ LaB₆ Ru Sc Sn TiN WO₃ ZnO₃ ZrY GST Hafnia Moly Ti Tungsten				Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)	1 4 inch wafer, 1 6 inch wafer
Malvern Dynamic Light Scattering (DLS) Zetasizer malvern-dls	Characterization > Dynamic Light Scattering	Flexible								Integrating Sphere	Pieces Other
Matrix Plasma Resist Strip matrix	Etching > Dry Etching > Downstream/Remote Plasma Etching Cleaning > Resist Removal > Dry Resist Removal > Downstream/Remote Plasma Resist Removal	Flexible	Resist	PI					O₂		4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂)	25
Minitech-GX Micromill micromill	Machining > Micromilling	Flexible
MRC Reactive Ion Etcher mrc	Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Reactive Ion Etching (RIE)	Flexible	Metal oxides Metals Metals or metal compounds with volatile byproducts Metals or metal compounds without volatile byproducts Au Ni poly(p-xylylene) Pt Si Si3N4 SiO₂ Ti Various 2D Materials Various Dielectrics Various polymers PI Resist	Al AlAs AlGaAs AlGaN AlInP AlN AlSi BiFeO₃ C C C Co CoFeB Cr Cu Er Fe Ga₂O₃ GaAs GaN GaP GaPN Ge Hf HfN III-N materials III-V materials In In₂O₃ InAlN InAs InGaAlN InGaAs InGaAsN InGaN InGaP InN InP InPN InSb Ir LaB₆ LiNb Nb Ni_xO_y NiSi Pd Ru Sc SiC SiGe SiO SiON Sn SnO₂ SrO SrRuO Ta Ta₂O₅ TaN TiN V Various C-based Various polymers W WO₃ WSi₂ Y ZnO₃ Zr ZrY Alumina AZO Hafnia ITO LLZO Moly Moly Oxide Poly Silicon Ti Tungsten Titania YSZ Zirconia					Ar CHClF₂ CHF₃ O₂ SF₆		Pieces 2" 3" 4" 6"		1
MVD mvd	Deposition > Atomic Layer Deposition (ALD) > Thermal ALD	Flexible			1.00 Å - 50.00 nm	C₉H₂₃NO₃Si Various Dielectrics Alumina DETA Hafnia ODS SAMS		24 °C - 150 °C	Ar		Pieces 2" 3" 4" 6" 8"
Nanoscribe Photonics GT nanoscribe	Patterning 3D Printing	Flexible											1
Optomec Printer optomec-printer	Deposition > Ink	Flexible									Pieces 2" 3" 4" 6"

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