Processing Technique Equipment name & NEMO ID Cleanliness Minimum Resolution Exposure Wavelength Substrate Size Maximum Load (number of wafers) Notes Stylus Tip Radius
Direct Write Heidelberg MLA 150
heidelberg 		"All" 1.00 μm 405 nm
1

Direct Write
Direct Write Heidelberg MLA 150 - 2
heidelberg2 		"All" 0.60 μm 375 nm
1

Direct Write
Direct Write Heidelberg3
heidelberg3 		"All"
1