Overview
The PVA TePla IoN 40 is a microwave plasma surface treatment system designed to clean and modify material surfaces. The 40-liter chamber uses RF energy to generate a controlled, low-temperature plasma for photoresist stripping, wafer descum, and surface cleaning. Plasma processing removes organic residues and cleans or modifies substrate surfaces.
Cleanliness:
Processing Technique(s)
Capabilities and Specifications
Primary Materials Etched
Primary Materials Etched:
Process Temperature Range:
20 °C - °C
Gases
Substrate Type
Substrate Sizes
Maximum Load:
25
Lab Organization, Location, and NEMO Information
Lab Organization:
Location:
NEMO Area:
NEMO ID:
Asher: PVA TePla
Training and Maintenance
Lab Facility:
Training Charges:
0.50 hours
Primary Trainer:
Backup Trainer(s):
Primary Maintenance: