Sub-micron metal patterning on polymer substrates using nitride nanostencil

Project Type:

E241

Date:

June 2021 (all day)

Areas of Interest:

Nano stencil, polymer and metal integration

Report:

Sub-micron metal patterning on polymer substrates using nitride nanostencil

Processing Technique (former Function and Method):

Patterning

Researchers and (Mentors):

Anqi Ji, Skyler Selvin, (Graham Ewing), (Swaroop Kommera), (Tony Ricco), (Mark Zdeblick)

List of Important Equipment:

AJA Evaporator (aja-evap)

Heidelberg MLA 150 (heidelberg)

PDMS Workbench ()

Nano Nugget:

SOP- Gold-PDMS adhesion enhancement

Adhesion between metals and polymers are rarely explored. For each type of polymer and metal combination, a customized adhesion method needs to be established- here is a case study for PDMS and Gold adhesion.

Read more about SOP- Gold-PDMS adhesion enhancement

SOP- Sub-micron metal patterning on polymer substrates using nitride nanostencil

A process flow of resist-free nanostencil lithography technique that allows sub-micron metal patterningon a polymer substrate is established.

Read more about SOP- Sub-micron metal patterning on polymer substrates using nitride nanostencil

Materials

Metals

PDMS

Polymer