Remote plasma etching or downstream plasma etching refers to the configuration wherein plasma is generated remotely relative to the process chamber and only the reactive species produced by the plasma reach the process chamber. This technique produces minimal surface damage at the substrate level and is used for plasma resist removal, surface cleaning and activation. In resist strip processes, the substrate is typically heated to enhance the reaction rate.
| Processing Technique | Equipment name & NEMO ID | Cleanliness | Primary Materials Etched | Other Materials Etched | Substrate Size | Maximum Load (number of wafers) | Gases | Notes | Stylus Tip Radius |
|---|---|---|---|---|---|---|---|---|---|
| Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching |
Gasonics Aura Asher gasonics |
Clean, Semiclean | 25 |
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Wafers heated by lamps. |
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| Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching |
Matrix Plasma Resist Strip matrix |
Flexible | 25 |
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating. |