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Sputtering

Sputtering is a physical vapor deposition method of thin film deposition. This involves ejecting material from a "target" that is a source onto a "substrate".

Technique Tabs

Main Tab

Processing Techniques	Equipment name & NEMO ID	Teaser Blurb	Cleanliness	Location
Sputtering	Hummer V Sputter Coater hummer		Flexible	SNF Exfab Paul G Allen L119 Año Nuevo
Sputtering	Lesker Sputter lesker-sputter		Flexible	SNF Exfab Paul G Allen 155A Venice
Sputtering	Lesker2 Sputter lesker2-sputter		Semiclean	SNF Cleanroom Paul G Allen L107

Detail Tab

Processing Technique	Equipment name & NEMO ID	Cleanliness	Materials Lab Supplied	Material Thickness Range	Substrate Size	Maximum Load (number of wafers)	Process Temperature Range	Gases	Notes
Sputtering	Hummer V Sputter Coater hummer	Flexible
Sputtering	Lesker Sputter lesker-sputter	Flexible	Ag Al AlSi Au Co Cr Cu Fe Nb Ni Pd Si SiO₂ Ta Ti TiN W Alumina ITO		Pieces 2" 3" 4" 6"	1 4 inch wafer, 1 6 inch wafer			reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Sputtering	Lesker2 Sputter lesker2-sputter	Semiclean	Ag Al AlSi Cr Ge Pd Ru Sc Si SiO₂ Sn Ta Ti TiN W Alumina ITO Moly	1.00 μm	Pieces 2" 3" 4" 6"	one 4 inch wafer, one 6 inch wafer	°C - 800 °C	Ar N₂ O₂	reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter