Processing of wafers with embedded Tungsten alignment marks in the clean equipment group
PROM Request Title:
Processing of wafers with embedded Tungsten alignment marks in the clean equipment group
PROM Request Summary:
Using clean etchers to process wafers with non-clean materials.
PROM Date:
06/19/2018
PROM Decision:
Request approved. Data appended.
Link to PROM Request and supporting documentation:
Equipment List:
