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Use of Stycast Epoxy for Non-galvanic Flip-chip Bonding

PROM Request Title: 
Use of Stycast Epoxy for Non-galvanic Flip-chip Bonding
PROM Request Summary: 
Documentation of procedure to use epoxy in flip-chip bonder.
PROM Date: 
11/15/2019
PROM Decision: 
Approved.
Link to PROM Request and supporting documentation: 
Use of Stycast Epoxy for Non-galvanic Flip-chip Bonding
Equipment List: 
Wet Bench Miscellaneous (wbmiscres)