HF wet etch to peel off PMMA film embedding graphene composites
PROM Request Title:
HF wet etch to peel off PMMA film embedding graphene composites
PROM Request Summary:
Request to use wb-flexcorr to undercut and remove film with encpsulated graphene oxide particles.
PROM Date:
02/23/2015
PROM Decision:
Request approved.
Link to PROM Request and supporting documentation:
Equipment List:
