The wafer saw is used to cut substrates into smaller pieces.
| Processing Technique | Equipment name & NEMO ID | Cleanliness | Substrate Size | Maximum Load (number of wafers) | Stylus Tip Radius |
|---|---|---|---|---|---|
| Wafer Saw |
DISCO Wafer Saw DISCO wafersaw |
Flexible | 1x4", 1x6" or 1x8" wafer, or pieces |