Solder Paste and Spheres for Finetech Bonding
PROM Request Title:
Solder Paste and Spheres for Finetech Bonding
PROM Request Summary:
Use of Pb-containing paste and spheres for soldering using Finetech Flip Chip Bonder.
PROM Date:
10/12/2016
PROM Decision:
Approved. Use of portable HEPA filter required due to Pb-containing materials.
Link to PROM Request and supporting documentation:
Equipment List:
