Project Type: 
nano@stanford Fellowship
Date: 
September 2019 (all day)
Areas of Interest: 
Flipchip Bonder
Processing Technique (former Function and Method): 
Bonding
Researchers and (Mentors): 
Pingyu Wang (Usha Raghuram)
List of Important Equipment: 
Finetech Lambda (flipchipbonder)
Notes: 
PDF File: operating_instructions_-_finetech_bonder_-_v190905.pdf
Source: 
Webform for documenting unusual processes
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Advanced Operation - do not perform without approval!

PDF File: operating_instructions_from_finetech_beamsplitter_alignment.pdf