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Stanford Nanofabrication Facility
Lab User Guide

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      • Fab Project Courses: E241 & EE412
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      • Device Process Courses: EE410 and EE312
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      • SNF Lab Manual
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      • "All" List of Tools
      • "Clean" List of Tools
        • "Clean-Ge" List of Tools
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  • Useful Links
    • Run NEMO (login required)
    • NEMO User Guide
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    • Wafer Dopant and Resistivity Specs
    • Face shield cleaning using steamer
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    • For Emergencies
    • Staff List
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    • Process Staff Liaisons
  • Equipment
    • Equipment Name Table
    • Characterization (link to Processing Techniques)
    • CVD (link to Processing Techniques)
      • MOCVD Equipment
      • ALD Equipment
      • PECVD Equipment
      • LPCVD Equipment
    • Doping (link to Processing Techniques)
    • Dry Etch (link to Processing Techniques)
      • RIE Etchers
      • Vapor Etchers
      • CCP Etchers
      • Downstream Plasma Etchers
      • ICP Etchers
      • Legacy Dry Etch Equipment Overview
    • Metallization (link to Processing Techniques)
    • Oxidation and Annealing (link to Processing Techniques)
    • Photolithography (link to Processing Techniques)
      • Lithography Oven Equipment
      • Resist Coat Equipment
      • Resist Develop Equipment
      • Resist Exposure Equipment
    • Wet Chemical Processing (link to Processing Techniques)

Hydrogel Fabrication Silanization FAQ

Hydrogel Fabrication Silanization FAQ

PDF File: Hydrogel Fabrication Silanization FAQ
Materials
Hydrogel

Book Navigation

  • ‹ Hydrogel Fabrication Exposure And Characterization FAQ
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