Dating back to the '80s, there have been numerous mentions of photoresist reflow being used in device fabrication. Surprisingly, reports of systematic empirical characterizations or analytical modelling of the reflow process have been relatively scarce. In this article, we summarize the main findings in the literature leading up to our own study, directly quoting published figures to capture the most information. In planning our splits, we aimed to generate data that would complement what has already been studied.