Equipment name & NEMO ID | Technique | Cleaning Required | Cleanliness | Material Thickness Range | Materials Lab Supplied | Process Temperature Range | Gases | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|---|---|
RTA AllWin 610 aw610_r |
Flexible |
21 °C - 1150 °C
|
, , |
|||||||
RTA AllWin 610 aw610_l |
Pre-Diffusion Clean | Clean |
21 °C - 1150 °C
|
, , |
1 wafer | |||||
Thermco3 Oxidation Furnace thermco 3 |
Pre-Diffusion Clean | Clean |
25.00 Å -
2.00 μm
|
700 °C - 1100 °C
|
50 | |||||
Tylan9 Forming Gas Anneal Furnace tylan9 |
Flexible |
250 °C - 1100 °C
|
, , |
50 | ||||||
Tystar Bank 1 Tube 1 B1T1 Flexible Oxide |
Flexible |
25.00 Å -
2.00 μm
|
400 °C - 1100 °C
|
, , |
100 | |||||
Tystar Bank 1 Tube 2 B1T2 Flexible Oxide Anneal |
Flexible |
25.00 Å -
2.00 μm
|
400 °C - 1100 °C
|
, , |
100 | |||||
Tystar Bank 2 Tube 5 B2T5 Clean Oxide Anneal |
Pre-Diffusion Clean | Clean |
25.00 Å -
2.00 μm
|
400 °C - 1100 °C
|
, , |
100 | ||||
Tystar Bank 2 Tube 6 B2T6 Clean Oxide |
Pre-Diffusion Clean | Clean |
25.00 Å -
2.00 μm
|
400 °C - 1100 °C
|
, , |
100 | ||||
Tystar Bank 3 Tube 9 B3T9 Clean Oxide |
Pre-Diffusion Clean | Clean |
25.00 Å -
2.00 μm
|
400 °C - 1100 °C
|
, , |
100 |