6:1 Buffered oxide etch

Preferred Short Name:

6:1 BOE

Chemical Formula:

34% NH₄F, 7% HF, 59% H₂O

Full Chemical Name (for In-Use Hazardous Chemicals card):

34% ammonium fluoride, 7% hydrofluoric acid, 59% water

BOE is an HF based etchant that is buffered to reduce impact to resist. This particular formulation is quite concentrated in HF and should only be used if needed. 20:1 BOE is a safer alternative for instances where there is not a lot of material to etch.

Equipment name & Badger ID	Training Required & Charges	Cleanliness	Location	Chemicals	Notes
Wet Bench Clean 2 wbclean-2	Wet Bench Clean1and2 Training 2.00 hours	Clean	SNF Cleanroom Paul G Allen L107	50:1 HF 6:1 BOE SC1 SC2	No resist allowed. Resist should have been removed at the wbclean_res-piranha
Wet Bench Clean_res-hf wbclean_res-hf	Wet Bench Clean Piranha/HF/Phosphoric Training 2.25 hours	Clean	SNF Cleanroom Paul G Allen L107	20:1 BOE 50:1 HF 6:1 BOE	Resist as mask allowed
Wet Bench CMOS Metal wbclean3	Wet Bench CMOS Metal (wbclean3) Training	Semiclean	SNF Cleanroom Paul G Allen L107	20:1 BOE 50:1 HF 6:1 BOE Al-Etch Ti-Etch W-etch	Al, Ti, or W wet etching or oxide etching
Wet Bench Flexcorr 1 wbflexcorr-1	Wet Bench Flexcorr 1and2 and 3and4 Training 2.00 hours	Flexible	SNF Cleanroom Paul G Allen L107	Acids Bases Gold Etchant 20:1 BOE 50:1 HF 6:1 BOE 9:1 Piranha Al-Etch Chrome Etch KOH SC1 SC2	Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.