Etching is a broad term that is used to describe the removal of material from your sample. The sub categories may be helpful for narrowing down your search, and be aware that there may be more than one technique and/or tool that could be used for your process. 

  • Dry etching uses gaseous chemistries and plasma energy to etch materials from the sample. 
  • Wet etching uses liquid chemistries to etch materials from samples. 
  • Vapor etching uses HF Vapor to etch materials. It is primarily used to etch structures that would be damaged during the rinse and dry process in a standard wet etch.
Processing Techniques Equipment name & NEMO ID Teaser Blurb Cleanliness Locationsort descending
Reactive Ion Etching (RIE) MRC Reactive Ion Etcher
mrc

The MRC is a general purpose, plasma reactive ion etching system, used to etch a variety of materials, including metals, oxides, nitrides, silicons, and some organic films.

Flexible SNF Paul G Allen L107 Cleanroom
Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching Gasonics Aura Asher
gasonics

The Gasonics Aura Asher is an automated down stream microwave plasma system used for stripping photoresist of 4 inch wafers in the 'clean' cleanliness group.

Clean, Semiclean SNF Paul G Allen L107 Cleanroom
Inductively Coupled Plasma Etching (ICP) Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL

PT-MTL is an ICP-RIE etch system configured for the etching of metals and metal-based compounds with volatile bi-products

Flexible SNF Paul G Allen L107 Cleanroom
Reactive Ion Etching (RIE) Plasmaetch PE-50
plasma-etch

The Plasmaetch PE-50 is located in Venice, and is used primarily for surface treatment, for example with PDMS.

Flexible SNF Exfab Paul G Allen 155A Venice

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