Standard Clean 1 | Stanford Nanofabrication Facility

Preferred Short Name:

SC1

Chemical Formula:

5:1:1 H₂O:H₂O₂:NH₄OH

Full Chemical Name:

DI water, Hydrogen peroxide, Ammonium hydroxide

SC1 is used to remove particles from substrates and as a surface preparation before going into growth furnaces. Due to the pH of the solution, particles removed from the surface are more likely to stay in solution than re-deposit back on the wafer surface.

Equipment name & NEMO ID	Training Required & Charges	Cleanliness	Location	Chemicals	Notes
Wet Bench Clean 1 wbclean-1	Wet Bench Clean1and2 Training 2.00 hours	Clean	SNF Paul G Allen L107 Cleanroom	50:1 HF SC1 SC2	No resist allowed. Resist should have been removed at the wbclean_res-piranha.
Wet Bench Clean 2 wbclean-2	Wet Bench Clean1and2 Training 2.00 hours	Clean	SNF Paul G Allen L107 Cleanroom	50:1 HF 6:1 BOE SC1 SC2	No resist allowed. Resist should have been removed at the wbclean_res-piranha
Wet Bench Flexcorr 1 wbflexcorr-1	Wet Bench Flexcorr 1and2 and 3and4 Training 2.00 hours	Flexible	SNF Paul G Allen L107 Cleanroom	Acids Bases Gold Etchant 20:1 BOE 50:1 HF 6:1 BOE 9:1 Piranha Al-Etch Chrome Etch KOH SC1 SC2	Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.