Acids are used typically to etch or clean substrates.

List of Acids

20:1 Buffered oxide etch

20:1 Buffered oxide etch (38% NH4F, 2% HF, 60% H2O)

aka "20:1 BOE"

(38% NH4F, 2% HF, 60% H2O)

50:1 Hydrofluoric Acid

50:1 Hydrofluoric Acid (50:1 HF)

aka "50:1 HF"

(50:1 HF)

6:1 Buffered oxide etch

6:1 Buffered oxide etch (34% NH4F, 7% HF, 59% H2O)

aka "6:1 BOE"

(34% NH4F, 7% HF, 59% H2O)

9:1 Piranha Solution

9:1 Piranha Solution (9:1 H2SO4:H2O2)

aka "9:1 Piranha"

(9:1 H2SO4:H2O2)

Standard Clean 1

Standard Clean 1 (5:1:1 H2O:H2O2:NH4OH)

aka "SC1"

(5:1:1 H2O:H2O2:NH4OH)

Standard Clean 2

Standard Clean 2 (H2O:H2O2:HCl (5:1:1))

aka "SC2"

(H2O:H2O2:HCl (5:1:1))
Partial words okay.
Equipment name & NEMO IDsort descending Training Required & Charges Cleanliness Location Chemicals Notes
Wet Bench Flexcorr 1
wbflexcorr-1 		Wet Bench Flexcorr 1and2 and 3and4 Training
2.00 hours
SNF Paul G Allen L107 Cleanroom

Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Wet Bench Flexcorr 2
wbflexcorr-2 		Wet Bench Flexcorr 1and2 and 3and4 Training
2.00 hours
SNF Paul G Allen L107 Cleanroom

Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Wet Bench Flexcorr 3
wbflexcorr-3 		Wet Bench Flexcorr 1and2 and 3and4 Training
2.00 hours
SNF Paul G Allen L107 Cleanroom

Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Wet Bench Flexcorr 4
wbflexcorr-4 		Wet Bench Flexcorr 1and2 and 3and4 Training
2.00 hours
SNF Paul G Allen L107 Cleanroom

Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.