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SNF: Metallization

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Equipment name & NEMO ID Training Required & Charges Cleanliness Location Notes
CHA Solutions II Evaporator
cha-evap 		Evaporator CHA Training Flexible SNF Paul G Allen L107 Cleanroom

For more than 300nm deposition, please contact Neel Mehta <nmehta26@stanford.edu> in advance
Intlvac Evaporator
Intlvac_evap 		Evaporator Intlvac Training Clean, Semiclean SNF Paul G Allen L107 Cleanroom
Equipment name & NEMO ID Technique Cleanliness Material Thickness Range Materials Lab Supplied Substrate Size Substrate Type Maximum Load
CHA Solutions II Evaporator
cha-evap
Flexible
0.00 - 300.00 nm
(Si)
,
(SiGe)
,
(SiO2)
,
(Al2O3)
,
(Ge)
,
(Various)
 4"x15 or 6"x3 wafers or pieces
Intlvac Evaporator
Intlvac_evap
Clean, Semiclean
0.00 - 0.50 μm
(Si)
,
(SiGe)
,
(SiO2)
 12 4 inch wafers, 2 6 inch wafers