Skip to content
Skip to navigation
Stanford Nanofabrication Facility
Navigation menu
Home
4% Forming gas
Chemical Formula:
4% H
2
in N
2
Gases Equipment Tabs
Etch Equipment Table
Equipment name or Badger ID
Partial words okay.
No equipment matches all of the filter criteria you have set above.
Anneal/Oxidation Equipment Table
Equipment name or Badger ID
Partial words okay.
Deposition Equipment
Equipment name & Badger ID
Cleanliness
Location
Material Thickness Range
Approved Materials supplied by Lab
RTA AllWin 610
aw610_l
Clean
SNF Cleanroom Paul G Allen L107
RTA AllWin 610
aw610_r
Flexible
SNF Cleanroom Paul G Allen L107
Tystar Bank 1 Tube 1 Anneal
B1T1 Flexible Oxide
Flexible
SNF Cleanroom Paul G Allen L107
25.00 Å
-
2.00 μm
Tystar Bank 1 Tube 2
B1T2 Flexible Oxide
Flexible
SNF Cleanroom Paul G Allen L107
25.00 Å
-
2.00 μm
SiO
2
Tystar Bank 2 Tube 5
B2T5 Clean Anneal
Clean
SNF Cleanroom Paul G Allen L107
25.00 Å
-
2.00 μm
Tystar Bank 2 Tube 6
B2T6 Clean Oxide
Clean
SNF Cleanroom Paul G Allen L107
25.00 Å
-
2.00 μm
SiO
2
Tystar Bank 3 Tube 9
B3T9 Clean Oxide
Clean
SNF Cleanroom Paul G Allen L107
25.00 Å
-
2.00 μm
SiO
2
