Bonding is a method of applying heat and/or pressure to two substrates to bond them together. Different equipment will have different substrate size tolerances and use different methods to create the bond.
| Processing Technique | Equipment name & NEMO ID | Cleanliness | Substrate Size | Maximum Load (number of wafers) | Process Temperature Range | Stylus Tip Radius |
|---|---|---|---|---|---|---|
| Bonding |
Finetech Lambda flipchipbonder |
Flexible | 1 |
°C - 400 °C
|