Bonding is a method of applying heat and/or pressure to two substrates to bond them together. Different equipment will have different substrate size tolerances and use different methods to create the bond.
| Processing Techniques | Equipment name & NEMO ID | Teaser Blurb | Cleanliness |
Location |
|---|---|---|---|---|
| Bonding |
Finetech Lambda flipchipbonder |
Flexible | SNF Exfab Paul G Allen 104 Stinson |