Oven BlueM 200°C to 430°C bluem |
Blue M Oven Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Convection in N2. Cure. Programmable. |
Wet Bench Flexcorr 2 wbflexcorr-2 |
Wet Bench Flexcorr 1and2 and 3and4 Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only |
Oven 110°C post-bake oven110 |
Resist Postbake Oven 110°C Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Bakes wafers with resist after the development, called post-bake. |
Samco PC300 Plasma Etch System samco |
Samco Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
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Profilometer AlphaStep D-300 alphastep2 |
AlphaStep2 Training |
Flexible |
SNF Exfab Paul G Allen L104 Stinson |
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Finetech Lambda flipchipbonder |
Flip Chip Bonder Training |
Flexible |
SNF Exfab Paul G Allen L104 Stinson |
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Heidelberg MLA 150 heidelberg |
Heidelberg Training |
"All" |
SNF Exfab Paul G Allen L104 Stinson |
Direct Write |
Nanospec 210XP nanospec2 |
Nanospec Training |
"All" |
SNF Exfab Paul G Allen L104 Stinson |
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
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Profilometer Alphastep 500 alphastep |
Alphastep 500 Profilometer Training |
Flexible |
SNF Exfab Paul G Allen L104 Stinson |
500Å to 300µm
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Heidelberg3 heidelberg3 |
Heidelberg Training |
"All" |
SNF Exfab Paul G Allen L104 Stinson |
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Keyence Digital Microscope VHX-6000 keyence |
Microscope Keyence Training |
"All" |
SNF Exfab Paul G Allen L104 Stinson |
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Prometrix Resistivity Mapping System |
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3 Probe Heads for different cleanliness groups.
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