Nanospec 210XP nanospec2 |
Nanospec Training |
"All" |
SNF Exfab Paul G Allen 104 Stinson |
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
|
Oven (White) white-oven |
White Oven Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable. |
Oven 110°C post-bake oven110 |
Resist Postbake Oven 110°C Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Bakes wafers with resist after the development, called post-bake. |
Oven 90°C prebake oven90 |
Resist Prebake Oven 90°C Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Bakes wafers after resist coating. |
Oven BlueM 200°C to 430°C bluem |
Blue M Oven Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Convection in N2. Cure. Programmable. |
PlasmaTherm Shuttlelock PECVD System ccp-dep |
PlasmaTherm Shuttlelock PECVD System Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -
Substrates in clean category: Pre-Diffusion Clean
For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run |
Profilometer Alphastep 500 alphastep |
Alphastep 500 Profilometer Training |
Flexible |
SNF Exfab Paul G Allen 104 Stinson |
500Å to 300µm |
Profilometer AlphaStep D-300 alphastep2 |
AlphaStep2 Training |
Flexible |
SNF Exfab Paul G Allen 104 Stinson |
|
Prometrix Resistivity Mapping System prometrix |
Prometrix Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
3 Probe Heads for different cleanliness groups. |
Samco PC300 Plasma Etch System samco |
Samco Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
|
Savannah ALD savannah |
ALD Savannah Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
|
SEM -Zeiss Merlin sem-merlin |
SEM-Merlin Training |
"All" |
SNF Exfab Paul G Allen 104 Stinson |
|
Sensofar S-neox s-neox |
Sensofar S-neox Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
non contact 3D optical profiling |
SPTS uetch vapor etch uetch |
SPTS uetch vapor etch Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Pieces need a carrier wafer; Isotropic Etching |
SVG Develop Track 1 svgdev |
SVG Resist Develop tracks 1 and 2 Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Automatic development. |
SVG Develop Track 2 svgdev2 |
SVG Resist Develop tracks 1 and 2 Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Automatic development. |
SVG Resist Coat Track 1 svgcoat |
SVG Resist Coat Tracks 1 and 2 Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Automatic Resist spinning and bake |
SVG Resist Coat Track 2 svgcoat2 |
SVG Resist Coat Tracks 1 and 2 Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal. |
Tystar Bank 1 Tube 3 Poly B1T3 Flexible Poly |
Tystar LPCVD Tube Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
|
Tystar Bank 1 Tube 4 LTO B1T4 Flexible LTO |
Tystar LPCVD Tube Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
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