Germanium

For more than 300nm deposition, please contact Gabe Catalano <gcatalano@stanford.edu> in advance

1:1 Contact Aligner. Backside align, including IR.

Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.

Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.

For more than 300nm deposition, please contact Neel Mehta <nmehta26@stanford.edu> in advance

3 Probe Heads for different cleanliness groups.

Isotropic Si etching; can be used for backside Si removal on small pieces