Etching is a broad term that is used to describe the removal of material from your sample. The sub categories may be helpful for narrowing down your search, and be aware that there may be more than one technique and/or tool that could be used for your process. 

  • Dry etching uses gaseous chemistries and plasma energy to etch materials from the sample. 
  • Wet etching uses liquid chemistries to etch materials from samples. 
  • Vapor etching uses HF Vapor to etch materials. It is primarily used to etch structures that would be damaged during the rinse and dry process in a standard wet etch.
Processing Techniques Equipment name & NEMO ID Teaser Blurb Cleanliness Locationsort descending
Vapor Etching Xactix Xenon Difluoride Etcher
xactix

The Xactix e-1 is a XeF2 (xenon difluoride) isotropic silicon etcher.

"All" SNF Paul G Allen L107 Cleanroom
Inductively Coupled Plasma Etching (ICP) Plasma Therm Versaline LL ICP Deep Silicon Etcher
PT-DSE

PT-DSE is an Deep Si etches using alternate gas technique similar to Bosch process.

Flexible SNF Paul G Allen L107 Cleanroom
Reactive Ion Etching (RIE) Oxford Dielectric Etcher
oxford-rie

Oxford-rie is to etch di-electric materials with fluorine based etch gases and oxygen.

Flexible SNF Paul G Allen L107 Cleanroom
Reactive Ion Etching (RIE) Plasmaetch PE-50
plasma-etch

The Plasmaetch PE-50 is located in Venice, and is used primarily for surface treatment, for example with PDMS.

Flexible SNF Exfab Paul G Allen 155A Venice

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