Deposition covers a wide variety of methods that are used to add a wide variety of materials. The subcategories here can be useful to help narrow down your search.

  • Atomic Layer Deposition (ALD) is used to deposit less than 50nm of highly conformal films.
  • Chemical Vapor Deposition (CVD) is used to deposit films less than 5μm thick, carbon nanotubes, and graphene.
  • Deposited III-N uses a type of CVD called MOCVD to deposit the nitrides of materials that are found in group III of the periodic table.
  • Deposited III-V uses a type of CVD called MOCVD to deposit combinations of materials from group III and group V of the periodic table.
  • Ink lists the equipment that can be used to print inks that are either commercially available or made by the user.
  • Physical Vapor Deposition (PVD) is used to deposit primarily metal layers as well as some dielectrics.
Processing Techniques Equipment name & NEMO ID Teaser Blurb Cleanliness Locationsort ascending
Sputtering Lesker2 Sputter
lesker2-sputter 		Semiclean SNF Paul G Allen L107 Cleanroom
Plasma Enhanced (PE) ALD Fiji 2 ALD
fiji2

Fiji2 is a load-locked, plasma-enabled atomic layer deposition (ALD) system. Fiji2 is currently classified as Flexible and is open to a wide range of metals and dielectrics.

 Flexible SNF Paul G Allen L107 Cleanroom
Evaporation AJA2 Evaporator
aja2-evap

This E-beam evaporator can evaporate a variety of metals (no oxides) onto your substrates. It has an integrated ion mill for substrate precleaning. 

 Flexible SNF Paul G Allen L107 Cleanroom
Plasma Enhanced (PE) ALD Fiji 3 ALD
fiji3

The Fiji3 ALD system from Cambridge Nanotech/Ultratech is a plasma enabled atomic layer deposition system for deposition of restricted oxide films. The system is in the Flexible cleanliness category and allows a limited subset of gold contaminated substrates.

 Flexible SNF Paul G Allen L107 Cleanroom
Low Pressure (LP) CVD Tystar Bank 1 Tube 3 Poly
B1T3 Flexible Poly

LPCVD of Poly silicon, Amorphous Silicon, Doped Silicon, Silicon-Germanium.

 Flexible SNF Paul G Allen L107 Cleanroom
Thermal ALD MVD
mvd

MVD is a molecular vapor deposition (MVD) system. It is a self assembling monolayers (SAMs)-based configuration of a Savannah S200 from Cambridge Nanotech with 1 SAMs delivery port and 4 standard atomic layer deposition (ALD) lines.  The system can accommodate pieces up to an 8" wafer.

 Flexible SNF Paul G Allen L107 Cleanroom
Low Pressure (LP) CVD Tystar Bank 3 Tube 12 Poly
B3T12 Clean Poly

LPCVD of Poly silicon, Amorphous Silicon, Doped Silicon.

 Clean SNF Paul G Allen L107 Cleanroom
Thermal ALD Savannah ALD
savannah 		Flexible SNF Paul G Allen L107 Cleanroom
Low Pressure (LP) CVD Tystar Bank 3 Tube 10 Nitride
B3T10 Clean Nitride

LPCVD of Silicon Nitride, Stoichiometric silicon nitride, low-stress silicon nitride, Silicon Oxy Nitride.

 Clean SNF Paul G Allen L107 Cleanroom
Low Pressure (LP) CVD Tystar Bank 2 Tube 7 Nitride
B2T7 Flexible Nitride

LPCVD of Stoichiometric silicon nitride, low-stress silicon nitride, Silicon Oxy Nitride.

 Flexible SNF Paul G Allen L107 Cleanroom
Low Pressure (LP) CVD Tystar Bank 1 Tube 4 LTO
B1T4 Flexible LTO

LPCVD of  Low Temperatur Oxide, PSG, BSG, BPSG.

 Flexible SNF Paul G Allen L107 Cleanroom
Sputtering Hummer V Sputter Coater
hummer 		Flexible SNF Exfab Paul G Allen 104 Stinson

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