PVD is characterized by a process in which the material goes from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.
| Processing Techniques | Equipment name & NEMO ID | Teaser Blurb | Cleanliness | Location |
|---|---|---|---|---|
| Evaporation |
AJA Evaporator aja-evap |
Flexible | SNF Exfab Paul G Allen 155A Venice | |
| Evaporation |
AJA2 Evaporator aja2-evap |
This E-beam evaporator can evaporate a variety of metals (no oxides) onto your substrates. It has an integrated ion mill for substrate precleaning. |
Flexible | SNF Paul G Allen L107 Cleanroom |
| Evaporation |
CHA Solutions II Evaporator cha-evap |
cha-evap is a non-load locked e-beam evaporator designed for higher throughput. |
Flexible | SNF Paul G Allen L107 Cleanroom |
| Sputtering |
Hummer V Sputter Coater hummer |
Flexible | SNF Exfab Paul G Allen 104 Stinson | |
| Evaporation |
Intlvac Evaporator Intlvac_evap |
Clean, Semiclean | SNF Paul G Allen L107 Cleanroom | |
| Sputtering |
Lesker Sputter lesker-sputter |
Flexible | SNF Exfab Paul G Allen 155A Venice | |
| Sputtering |
Lesker2 Sputter lesker2-sputter |
Semiclean | SNF Paul G Allen L107 Cleanroom |