Equipment name & NEMO ID |
Training Required & Charges![]() |
Cleanliness | Location | Notes |
---|---|---|---|---|
Tystar Bank 3 Tube 10 Nitride B3T10 Clean Nitride |
Tystar LPCVD Tube Training | Clean | SNF Cleanroom Paul G Allen L107 | |
Tystar Bank 3 Tube 12 Poly B3T12 Clean Poly |
Tystar LPCVD Tube Training | Clean | SNF Cleanroom Paul G Allen L107 | |
Tystar Bank 1 Tube 3 Poly B1T3 Flexible Poly |
Tystar LPCVD Tube Training | Flexible | SNF Cleanroom Paul G Allen L107 | |
CHA Solutions II Evaporator cha-evap |
Evaporator CHA Training | Flexible | SNF Cleanroom Paul G Allen L107 |
For more than 300nm deposition, please contact Neel Mehta <nmehta26@stanford.edu> in advance |
SEM: FEI Nova NanoSEM 450 | SEM: FEI Nova NanoSEM 450 Training | All | SNSF NPC Cleanroom Spilker suite006 |
The FEI Nova NanoSEM will be decommissioned in the week of February 3rd 2025 |
Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Developer | Process Temperature Range | Chemicals | Gases | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|---|---|
Wet Bench Miscellaneous wbmiscres |
Flexible |
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Wet Bench Resist Strip wbresstrip-1 |
Clean (Ge), Semiclean, Flexible |
20 °C - 60 °C
|
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25 4 inch wafers | ||||||
Wet Bench Solvent Lithography lithosolv |
Flexible |
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Woollam woollam |
All |
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1 | |||||||
Xactix Xenon Difluoride Etcher xactix |
All |
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1 |