The following is a list of equipment where 4 inch round substrates are allowed.
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
SU-8, LOL, Ebeam resists allowed. No Acetone allowed.
non contact 3D optical profiling
Direct Write
Resist will be removed
Spray coating of resists
N and P doping available- intrinsic to 5E19 Operating pressure range is 5-300Torr
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Automatic Resist spinning and bake
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter