The following is a list of equipment where 4 inch round substrates are allowed.
Metal etching or Metal hard masks are not allowed. 4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers; Restrictions: III-V materials only.
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
SU-8, LOL, Ebeam resists allowed. No Acetone allowed.
non contact 3D optical profiling
Direct Write
Resist will be removed
Spray coating of resists
N and P doping available- intrinsic to 5E19 Operating pressure range is 5-300Torr
Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Automatic Resist spinning and bake
Manual development of resist in beakers. SNF approved developers only. No solvents!