4 inch wafer

Short Name:

4"

The following is a list of equipment where 4 inch round substrates are allowed.

Equipment Tables

Equipment name & NEMO ID	Training Required & Charges	Cleanliness	Location	Notes
Keyence Digital Microscope VHX-6000 keyence	Microscope Keyence Training	"All"	SNF Exfab Paul G Allen 104 Stinson
Nanospec 210XP nanospec2	Nanospec Training	"All"	SNF Exfab Paul G Allen 104 Stinson	Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
Heidelberg MLA 150 heidelberg	Heidelberg Training	"All"	SNF Exfab Paul G Allen 104 Stinson	Direct Write
Profilometer Alphastep 500 alphastep	Alphastep 500 Profilometer Training	Flexible	SNF Exfab Paul G Allen 104 Stinson	500Å to 300µm
SEM -Zeiss Merlin sem-merlin	SEM-Merlin Training	"All"	SNF Exfab Paul G Allen 104 Stinson
Profilometer AlphaStep D-300 alphastep2	AlphaStep2 Training	Flexible	SNF Exfab Paul G Allen 104 Stinson
Headway 3 Manual Resist Spinner headway3	Resist Coat (manual) Headway 3 Training	"All"	SNF Exfab Paul G Allen 104 Stinson
Ex Fab Develop Wet Bench wbexfab_dev	WbExfab_Dev Training	Flexible	SNF Exfab Paul G Allen 104 Stinson	Manual development of resist in beakers. SNF approved developers only. No solvents!
Ex Fab Solvent Wet Bench wbexfab_solv	WbExfab_Solv Training	Flexible	SNF Exfab Paul G Allen 104 Stinson
Finetech Lambda flipchipbonder	Flip Chip Bonder Training	Flexible	SNF Exfab Paul G Allen 104 Stinson
Fiji 1 ALD fiji1	ALD Fiji 1 and 2 Training	Semiclean	SNF Paul G Allen L107 Cleanroom
Wet Bench Decontamination wbdecon	Wet Bench Decontamination Training	Clean	SNF Paul G Allen L107 Cleanroom	KOH or wafersaw or post-cmp decontamination
SVG Develop Track 1 svgdev	SVG Resist Develop tracks 1 and 2 Training	"All"	SNF Paul G Allen L107 Cleanroom	Automatic development.
Tystar Bank 3 Tube 10 Nitride B3T10 Clean Nitride	Tystar LPCVD Tube Training	Clean	SNF Paul G Allen L107 Cleanroom
Oxford III-V etcher Ox-35	Oxford III-V etcher Training	Flexible	SNF Paul G Allen L107 Cleanroom	Metal etching or Metal hard masks are not allowed. 4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers; Restrictions: III-V materials only.
Wet Bench Solvent Lithography lithosolv	Lithography Solvent Bench Training	Flexible	SNF Paul G Allen L107 Cleanroom	Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.
Laurell Manual Resist Spinner laurell-R	Laurell Manual Resist Spinner Training	"All"	SNF Paul G Allen L107 Cleanroom	SU-8, LOL, Ebeam resists allowed. No Acetone allowed.
Sensofar S-neox s-neox	Sensofar S-neox Training	"All"	SNF Paul G Allen L107 Cleanroom	non contact 3D optical profiling
Heidelberg MLA 150 - 2 heidelberg2	Heidelberg Training	"All"	SNF Paul G Allen L107 Cleanroom	Direct Write
Tystar Bank 2 Tube 7 Nitride B2T7 Flexible Nitride	Tystar LPCVD Tube Training	Flexible	SNF Paul G Allen L107 Cleanroom

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