4 inch wafer

Short Name:

The following is a list of equipment where 4 inch round substrates are allowed.

Equipment Tables

Equipment name & NEMO ID	Training Required & Charges	Cleanliness	Location	Notes
Headway 3 Manual Resist Spinner headway3	Resist Coat (manual) Headway 3 Training	"All"	SNF Exfab Paul G Allen L104 Stinson
Ex Fab Develop Wet Bench wbexfab_dev	WbExfab_Dev Training	Flexible	SNF Exfab Paul G Allen L104 Stinson	Manual development of resist in beakers. SNF approved developers only. No solvents!
Ex Fab Solvent Wet Bench wbexfab_solv	WbExfab_Solv Training	Flexible	SNF Exfab Paul G Allen L104 Stinson
Finetech Lambda flipchipbonder	Flip Chip Bonder Training	Flexible	SNF Exfab Paul G Allen L104 Stinson
Keyence Digital Microscope VHX-6000 keyence	Microscope Keyence Training	"All"	SNF Exfab Paul G Allen L104 Stinson
Nanospec 210XP nanospec2	Nanospec Training	"All"	SNF Exfab Paul G Allen L104 Stinson	Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
Heidelberg MLA 150 heidelberg	Heidelberg Training	"All"	SNF Exfab Paul G Allen L104 Stinson	Direct Write
Profilometer Alphastep 500 alphastep	Alphastep 500 Profilometer Training	Flexible	SNF Exfab Paul G Allen L104 Stinson	500Å to 300µm
Prometrix Resistivity Mapping System				3 Probe Heads for different cleanliness groups.