The following is a list of equipment where 4 inch round substrates are allowed.
For more than 300nm deposition, please contact Gabe Catalano <gcatalano@stanford.edu> in advance
Resist should have been removed
No resist allowed. Resist should have been removed at the wbclean_res-piranha.
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode
Convection in N2. Cure. Programmable.
Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.
Low power, high pressure plasma; low bias, minimal damage. Often used for surface treatment.