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Gallium Arsenide

Chemical Formula: 
GaAs
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Equipment name & NEMO ID Training Required & Chargessort ascending Cleanliness Location Notes
Wet Bench Flexible Solvents
wbflexsolv
Wet Bench Flexible Solvents 1 and 2 Training Flexible SNF Paul G Allen L107 Cleanroom

Manual solvent cleaning of substrates or resist removal.

Wet Bench Flexcorr 2
wbflexcorr-2
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Paul G Allen L107 Cleanroom

Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only

Wet Bench Flexcorr 1
wbflexcorr-1
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Paul G Allen L107 Cleanroom

Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.

SVG Develop Track 2
svgdev2
SVG Resist Develop tracks 1 and 2 Training "All" SNF Paul G Allen L107 Cleanroom

Automatic development.

SVG Develop Track 1
svgdev
SVG Resist Develop tracks 1 and 2 Training "All" SNF Paul G Allen L107 Cleanroom

Automatic development.

SVG Resist Coat Track 1
svgcoat
SVG Resist Coat Tracks 1 and 2 Training "All" SNF Paul G Allen L107 Cleanroom

Automatic Resist spinning and bake

SVG Resist Coat Track 2
svgcoat2
SVG Resist Coat Tracks 1 and 2 Training "All" SNF Paul G Allen L107 Cleanroom

Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.

SPTS uetch vapor etch
uetch
SPTS uetch vapor etch Training "All" SNF Paul G Allen L107 Cleanroom

Pieces need a carrier wafer; Isotropic Etching

Prometrix Resistivity Mapping System
prometrix
Prometrix Training "All" SNF Paul G Allen L107 Cleanroom

3 Probe Heads for different cleanliness groups.

Nanospec 210XP
nanospec2
Nanospec Training "All" SNF Exfab Paul G Allen 104 Stinson

Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Å

micromanipulator6000 IV-CV probe station
micromanipulator6000
micromanipulator6000 IV-CV probe station Training "All" SNF Exfab Paul G Allen 151 Ocean
Wet Bench Solvent Lithography
lithosolv
Lithography Solvent Bench Training Flexible SNF Paul G Allen L107 Cleanroom

Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.

Karl Suss MA-6 Contact Aligner
karlsuss2
Contact Aligner Karl Suss MA-6 Training "All" SNF Paul G Allen L107 Cleanroom

1:1 Contact Aligner.
Backside align.

Karl Suss MA-6 Contact Aligner
karlsuss
Contact Aligner Karl Suss MA-6 Training "All" SNF Paul G Allen L107 Cleanroom

1:1 Contact Aligner.
Backside align, including IR.

Woollam
woollam
Woollam Training "All" SNF Paul G Allen L107 Cleanroom
Headway Manual Resist Spinner
headway2
Resist Coat (manual) Headway Manual Training "All" SNF Paul G Allen L107 Cleanroom

Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists

Critical Point Dryer Tousimis Automegasamdri-936
cpd
Critical Point Dryer Training Flexible SNF Paul G Allen L107 Cleanroom

CO2 drying after release of micromachined devices

Oven BlueM 200°C to 430°C
bluem
Blue M Oven Training Flexible SNF Paul G Allen L107 Cleanroom

Convection in N2. Cure. Programmable.

Profilometer Alphastep 500
alphastep
Alphastep 500 Profilometer Training Flexible SNF Exfab Paul G Allen 104 Stinson

500Å to 300µm

Oven 110°C post-bake
oven110
Resist Postbake Oven 110°C Training "All" SNF Paul G Allen L107 Cleanroom

Bakes wafers with resist after the development, called post-bake.

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Equipment name & NEMO ID Technique Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Resist Developer Process Temperature Range Chemicals Gases Sample Size Limits Substrate Size Substrate Type Maximum Load
Oven BlueM 200°C to 430°C
bluem
Flexible
0 °C - 430 °C
,
,
,
,
,
,
,
,
,
PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Flexible ,
,
,
,
,
,
,
,
,
,
,
,
Profilometer Alphastep 500
alphastep
Flexible ,
,
,
,
,
,
,
,
1
Profilometer AlphaStep D-300
alphastep2
Flexible ,
,
,
,
,
,
,
,
,
,
,
,
1
Prometrix Resistivity Mapping System
prometrix
"All" ,
,
,
,
,
,
,
,
1
Samco PC300 Plasma Etch System
samco
Flexible
20 ºC
,
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,
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,
Four 4" wafers or two 6" wafers and one 8" wafer
SEM -Zeiss Merlin
sem-merlin
"All"
0.00 mm - 35.00 mm
6 in wafer ,
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one
Sensofar S-neox
s-neox
"All" ,
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1
SPTS uetch vapor etch
uetch
"All" ,
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,
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1
SVG Develop Track 1
svgdev
"All"
,
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,
25 4 inch wafers
SVG Develop Track 2
svgdev2
"All"
,
,
,
,
,
,
,
,
25 4 inch wafers
SVG Resist Coat Track 1
svgcoat
"All"
,
,
,
,
,
,
,
,
25 4 inch wafers
SVG Resist Coat Track 2
svgcoat2
"All"
,
,
,
,
,
,
,
,
25 4 inch wafers
Wet Bench Flexcorr 1
wbflexcorr-1
Flexible ,
,
,
,
,
,
,
,
,
,
Wet Bench Flexcorr 2
wbflexcorr-2
Flexible ,
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Wet Bench Flexible Solvents
wbflexsolv
Flexible ,
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Wet Bench Flexible Solvents 1
wbflexsolv-1
Flexible ,
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Wet Bench Flexible Solvents 2
wbflexsolv-2
Flexible ,
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Wet Bench Miscellaneous
wbmiscres
Flexible ,
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Wet Bench Solvent Lithography
lithosolv
Flexible ,
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,
,
,
,
,

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