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Gallium Arsenide

Chemical Formula: 
GaAs
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Equipment name & NEMO ID Training Required & Chargessort ascending Cleanliness Location Notes
Profilometer AlphaStep D-300
alphastep2
AlphaStep2 Training Flexible SNF Exfab Paul G Allen 104 Stinson
SEM -Zeiss Merlin
sem-merlin
SEM-Merlin Training All SNF Exfab Paul G Allen 104 Stinson
Lesker2 Sputter
lesker2-sputter
Sputter Lesker 1&2 Training Semiclean SNF Cleanroom Paul G Allen L107

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Lesker Sputter
lesker-sputter
Sputter Lesker 1&2 Training Flexible SNF Exfab Paul G Allen 155A Venice

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Samco PC300 Plasma Etch System
samco
Samco Training Flexible SNF Cleanroom Paul G Allen L107
Lakeshore Hall Measurement System
LakeshoreHall
Lakeshore Hall Measurement System training All SNF Exfab Paul G Allen 151 Ocean
LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
LEI1500 Contactless Sheet Resistance Mapping Training All SNF Exfab Paul G Allen 151 Ocean
Keyence Digital Microscope VHX-6000
keyence
Microscope Keyence Training All SNF Exfab Paul G Allen 104 Stinson
PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Parylene Coater Training Flexible SNF Exfab Paul G Allen 155 Mavericks
Heidelberg MLA 150 - 2
heidelberg2
Heidelberg Training All SNF Cleanroom Paul G Allen L107

Direct Write

Heidelberg MLA 150
heidelberg
Heidelberg Training All SNF Exfab Paul G Allen 104 Stinson

Direct Write

AJA Evaporator
aja-evap
Evaporator AJA training Flexible SNF Exfab Paul G Allen 155A Venice

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

Oven (White)
white-oven
White Oven Training Flexible SNF Cleanroom Paul G Allen L107

For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.

Flexus 2320 Stress Tester
stresstest
Stress Tester Flexus 2320 Training All SNF Cleanroom Paul G Allen L107
Sensofar S-neox
s-neox
Sensofar S-neox Training All SNF Cleanroom Paul G Allen L107

non contact 3D optical profiling

HMDS Vapor Prime Oven, YES
yes
YES Prime Oven Training All SNF Cleanroom Paul G Allen L107

Two programs: Singe and HMDS prime or Singe only. No Resist allowed!

Xactix Xenon Difluoride Etcher
xactix
Xactix Xenon Difluoride Etcher Training All SNF Cleanroom Paul G Allen L107

Isotropic Si etching; can be used for backside Si removal on small pieces

Wet Bench Miscellaneous
wbmiscres
Wet Bench Miscellaneous Photoresist Training Flexible SNF Cleanroom Paul G Allen L107

Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!

Wet Bench Flexible Solvents
wbflexsolv
Wet Bench Flexible Solvents 1 and 2 Training Flexible SNF Cleanroom Paul G Allen L107

Manual solvent cleaning of substrates or resist removal.

Wet Bench Flexible Solvents 1
wbflexsolv-1
Wet Bench Flexible Solvents 1 and 2 Training Flexible SNF Cleanroom Paul G Allen L107

Manual solvent cleaning, two ultrasonic baths.

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Equipment name & NEMO ID Technique Cleaning Required Cleanliness Material Thickness Range Materials Lab Supplied Materials User Supplied Minimum Resolution Exposure Wavelength Mask Size Max Exposure Area Resist Process Temperature Range Chemicals Gases Sample Size Limits Resolution Notes Substrate Size Substrate Type Maximum Load
Aixtron MOCVD - III-V system
aix200
Pre-Diffusion Clean Flexible
0.00 - 5.00 μm
300 °C - 800 °C
,
,
,
4"x1 wafer or 2"x1 wafer or 4 pieces
AJA Evaporator
aja-evap
Flexible
0.00 - 300.00 nm
,
,
,
,
,
,
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
Critical Point Dryer Tousimis Automegasamdri-936
cpd
Flexible
,
,
,
,
,
,
,
,
,
Flexus 2320 Stress Tester
stresstest
All ,
,
,
,
,
,
,
,
1
Headway Manual Resist Spinner
headway2
All ,
,
,
,
,
,
,
,
,
one piece or wafer
Heidelberg MLA 150
heidelberg
All
405 nm ,
,
,
,
,
,
,
,
,
,
,
,
1
Heidelberg MLA 150 - 2
heidelberg2
All
375 nm ,
,
,
,
,
,
,
,
,
,
,
,
1
HMDS Vapor Prime Oven, YES
yes
All
150 ºC
,
,
,
,
,
,
,
,
Karl Suss MA-6 Contact Aligner
karlsuss
All
365 nm 4 inch, 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch ,
,
,
,
,
,
,
,
,
Karl Suss MA-6 Contact Aligner
karlsuss2
All
365 nm or 405 nm 4 inch, 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch ,
,
,
,
,
,
,
,
,
Keyence Digital Microscope VHX-6000
keyence
All ,
,
,
,
,
,
,
,
Lakeshore Hall Measurement System
LakeshoreHall
All
100.00 μm - 1000.00 μm
-258 °C - 1000 °C
8 in wafer

Sensor Transducer Size is 14 mm diameter 

,
,
,
,
,
,
,
,
,
,
1 piece
LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
All 8 in wafer

Sensor Transducer Size is 14 mm diameter 

,
,
,
,
,
,
,
,
,
,
,
1 wafer(2" to 8")
Lesker Sputter
lesker-sputter
Flexible ,
,
,
,
,
,
,
,
,
1 4 inch wafer, 1 6 inch wafer
Lesker2 Sputter
lesker2-sputter
Semiclean
1.00 μm
°C - 800 °C
,
,
,
,
,
,
,
,
,
one 4 inch wafer, one 6 inch wafer
micromanipulator6000 IV-CV probe station
micromanipulator6000
All ,
,
,
,
,
,
,
,
,
,
,
1x4" wafer
Nanospec 210XP
nanospec2
All ,
,
,
,
,
,
,
,
Oven (White)
white-oven
Flexible
0 °C - 200 °C
,
,
,
,
,
,
,
,
Oven 110°C post-bake
oven110
All
110 ºC
,
,
,
,
,
,
,
,
,
Oven 90°C prebake
oven90
All
90 ºC
,
,
,
,
,
,
,
,

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