Aixtron MOCVD - III-V system aix200 |
MOCVD - III-V Aixtron training |
Flexible |
SNF MOCVD Paul G Allen 213XA |
N and P doping available.
For Si clean: SC1, SC2, HF dip.
For III-V clean: HCl or HF dip. |
Oven 90°C prebake oven90 |
Resist Prebake Oven 90°C Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Bakes wafers after resist coating. |
Oven 110°C post-bake oven110 |
Resist Postbake Oven 110°C Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Bakes wafers with resist after the development, called post-bake. |
Profilometer Alphastep 500 alphastep |
Alphastep 500 Profilometer Training |
Flexible |
SNF Exfab Paul G Allen 104 Stinson |
500Å to 300µm |
Oven BlueM 200°C to 430°C bluem |
Blue M Oven Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Convection in N2. Cure. Programmable. |
Critical Point Dryer Tousimis Automegasamdri-936 cpd |
Critical Point Dryer Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
CO2 drying after release of micromachined devices |
Headway Manual Resist Spinner headway2 |
Resist Coat (manual) Headway Manual Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists |
Woollam woollam |
Woollam Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
|
Karl Suss MA-6 Contact Aligner karlsuss2 |
Contact Aligner Karl Suss MA-6 Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
1:1 Contact Aligner.
Backside align. |
Karl Suss MA-6 Contact Aligner karlsuss |
Contact Aligner Karl Suss MA-6 Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
1:1 Contact Aligner.
Backside align, including IR. |
Wet Bench Solvent Lithography lithosolv |
Lithography Solvent Bench Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning. |
micromanipulator6000 IV-CV probe station micromanipulator6000 |
micromanipulator6000 IV-CV probe station Training |
"All" |
SNF Exfab Paul G Allen 151 Ocean |
|
Nanospec 210XP nanospec2 |
Nanospec Training |
"All" |
SNF Exfab Paul G Allen 104 Stinson |
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã
|
Prometrix Resistivity Mapping System prometrix |
Prometrix Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
3 Probe Heads for different cleanliness groups. |
SPTS uetch vapor etch uetch |
SPTS uetch vapor etch Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Pieces need a carrier wafer; Isotropic Etching |
SVG Resist Coat Track 2 svgcoat2 |
SVG Resist Coat Tracks 1 and 2 Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal. |
SVG Resist Coat Track 1 svgcoat |
SVG Resist Coat Tracks 1 and 2 Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Automatic Resist spinning and bake |
SVG Develop Track 1 svgdev |
SVG Resist Develop tracks 1 and 2 Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Automatic development. |
SVG Develop Track 2 svgdev2 |
SVG Resist Develop tracks 1 and 2 Training |
"All" |
SNF Paul G Allen L107 Cleanroom |
Automatic development. |
Wet Bench Flexcorr 1 wbflexcorr-1 |
Wet Bench Flexcorr 1and2 and 3and4 Training |
Flexible |
SNF Paul G Allen L107 Cleanroom |
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only. |